Patent Assignment
Reel/Frame 035017/0579
Assignment of Assignor's Interest
Recorded: 2015-02-24
Pages: 6
Assignors
PARK, JONG LAE
Executed: 2014-11-06
LEE, WOO JIN
Executed: 2014-11-06
PARK, SANG IL
Executed: 2014-11-06
LEE, GYEONG TEAK
Executed: 2014-11-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
System on Chip Method Thereof, and Device Including the Same