Patent Assignment
Reel/Frame 035027/0194
Assignment of Assignor's Interest
Recorded: 2015-02-25
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Manufacturing Method Thereof