Patent Assignment
Reel/Frame 035037/0091
Assignment of Assignor's Interest
Recorded: 2015-02-26
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2015-02-02
YEH, DER-CHYANG
Executed: 2015-02-02
SU, AN-JHIH
Executed: 2015-02-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packages and Methods of Forming Packages