Patent Assignment
Reel/Frame 035042/0489
Assignment of Assignor's Interest
Recorded: 2015-02-26
Pages: 10
Assignors
CHENG, KANGGUO
Executed: 2013-01-16
IYER, SUBRAMANIAN S.
Executed: 2013-01-17
KERBER, PRANITA
Executed: 2013-01-16
KHAKIFIROOZ, ALI
Executed: 2013-01-16
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method for Forming Through Silicon via in N+ Epitaxy Wafers with Reduced Parasitic Capacitance