Patent Assignment
Reel/Frame 035060/0301
Assignment of Assignor's Interest
Recorded: 2015-02-20
Pages: 6
Assignors
UEDA, KENJI
Executed: 2014-12-19
INAGAKI, YASUHITO
Executed: 2014-12-19
OHE, TAKAHIRO
Executed: 2014-12-26
YAMADA, ATSUSHI
Executed: 2014-12-19
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Resin Composition and Resin Molded Object