Patent Assignment
Reel/Frame 035061/0786
Assignment of Assignor's Interest
Recorded: 2015-03-02
Pages: 4
Assignors
BARWICZ, TYMON
Executed: 2015-02-27
MARTIN, YVES C.
Executed: 2015-02-27
NAH, JAE-WOONG
Executed: 2015-02-27
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Three Dimensional Self-Alignment of Flip Chip Assembly Using Solder Surface Tension During Solder Reflow