IP Library › Assignment 035074/0688
Patent Assignment
Reel/Frame 035074/0688

Assignment of Assignor's Interest

Recorded: 2015-03-03 Pages: 6
Assignors
WANG, LEI
Executed: 2013-12-20
LEONG, LUP SAN
Executed: 2013-12-31
LU, WEI
Executed: 2013-12-31
SEE, ALEX
Executed: 2013-12-31
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Integrated Circuits with Improved Gap Fill Dielectric and Methods for Fabricating Same
Patent: 9,202,746 →
Application: 14/145,581 →
Publication: US 2015/0187641
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 2, 2019
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049669/0775 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →