Patent Assignment
Reel/Frame 035074/0788
Assignment of Assignor's Interest
Recorded: 2015-02-24
Pages: 2
Assignor
HAREYAMA, KOSUKE
Executed: 2014-12-26
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Wiring Board and Method of Manufacturing Wiring Board