IP Library › Assignment 035098/0092
Patent Assignment
Reel/Frame 035098/0092

Assignment of Assignor's Interest

Recorded: 2015-03-05 Pages: 5
Assignors
LEE, JAEGOO
Executed: 2014-12-18
PARK, YOUNGWOO
Executed: 2014-12-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Three-Dimensional (3D) Semiconductor Devices and Methods of Fabricating 3D Semiconductor Devices
Patent: 9,362,226 →
Application: 14/637,755 →
Publication: US 2015/0255386