Patent Assignment
Reel/Frame 035105/0308
Assignment of Assignor's Interest
Recorded: 2015-03-06
Pages: 6
Assignors
AGARWAL, SUMIT
Executed: 2014-10-21
KUO, CHIU-PIEN
Executed: 2014-11-21
HSIEH, SHANG-TING
Executed: 2014-11-21
HONG, GUOCHUAN
Executed: 2014-11-21
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method for Etching a Hardmask Layer for an Interconnection Structure for Semiconductor Applications
Application:
14/485,346 →
Publication:
US 2016/0079088