Patent Assignment
Reel/Frame 035127/0794
Assignment of Assignor's Interest
Recorded: 2015-03-10
Pages: 4
Assignee
SHIN-ETSU HANDOTAI CO., LTD.
6-2, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing Soi Wafer