Patent Assignment
Reel/Frame 035127/0875
Assignment of Assignor's Interest
Recorded: 2015-03-10
Pages: 6
Assignors
BOURBINA, MICHAEL
Executed: 2012-03-12
BREMMER, JEFFREY N
Executed: 2012-03-12
MOYER, ERIC S
Executed: 2012-03-21
WANG, SHENG
Executed: 2012-03-12
YEAKLE, CRAIG R
Executed: 2012-03-12
Assignee
DOW CORNING CORPORATION
2200 WEST SALZBURG ROAD, MIDLAND, MICHIGAN, 48686-0994
Covered Property
(1)
Wafer Bonding System and Method for Bonding and Debonding Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.