Patent Assignment
Reel/Frame 035136/0388
Assignment of Assignor's Interest
Recorded: 2015-03-11
Pages: 3
Assignors
NOVESKI, VLADIMIR
Executed: 2015-02-06
SHAH, MILIND PRAVIN
Executed: 2015-02-05
KUMAR, RAJNEESH
Executed: 2015-02-05
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Integrated Device Package Comprising Photo Sensitive Fill Between a Substrate and a Die