Patent Assignment
Reel/Frame 035183/0725
Assignment of Assignor's Interest
Recorded: 2015-03-17
Pages: 3
Assignors
IWAI, YU
Executed: 2015-03-02
FUJIMAKI, KAZUHIRO
Executed: 2015-03-02
KOYAMA, ICHIRO
Executed: 2015-03-02
Assignee
FUJIFILM CORPORATION
26-30, NISHIAZABU 2-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Temporary Adhesive for Production of Semiconductor Device, and Adhesive Support and Production Method of Semiconductor Device Using the Same