Patent Assignment
Reel/Frame 035195/0557
Assignment of Assignor's Interest
Recorded: 2015-03-18
Pages: 4
Assignors
LIN, YEN-LIANG
Executed: 2014-08-18
HUANG, CHANG-CHIA
Executed: 2014-08-18
KUO, TIN-HAO
Executed: 2014-08-18
WU, SHENG-YU
Executed: 2014-08-18
CHEN, CHEN-SHIEN
Executed: 2014-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Methods and Apparatus for bump-on-trace Chip Packaging