Patent Assignment
Reel/Frame 035228/0372
Assignment of Assignor's Interest
Recorded: 2015-03-23
Pages: 4
Assignors
SEYAMA, KOHEI
Executed: 2015-02-03
CHIDA, YASUHIRO
Executed: 2015-01-28
KAKUTANI, OSAMU
Executed: 2015-02-02
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Heater for Bonding Apparatus and Method of Cooling the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.