Patent Assignment
Reel/Frame 035242/0073
Assignment of Assignor's Interest
Recorded: 2015-03-24
Pages: 6
Assignors
HOTTA, TAKANOBU
Executed: 2015-03-16
AIBA, YASUSHI
Executed: 2015-03-18
MAEKAWA, KOJI
Executed: 2015-03-16
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 1076325, JAPAN
Covered Property
(1)
Tungsten Film Forming Method, Semiconductor Device Manufacturing Method, and Storage Medium