Patent Assignment
Reel/Frame 035256/0635
Assignment of Assignor's Interest
Recorded: 2015-03-25
Pages: 3
Assignor
LUAN, JING-EN
Executed: 2015-03-21
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Wafer Level Packaging for Proximity Sensor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.