Patent Assignment
Reel/Frame 035257/0843
Assignment of Assignor's Interest
Recorded: 2015-03-25
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Stack Structure Having Interposer Substrate