Patent Assignment
Reel/Frame 035259/0724
Assignment of Assignor's Interest
Recorded: 2015-03-26
Pages: 3
Assignors
LIN, PO-YAO
Executed: 2015-03-05
LIN, WEN-YI
Executed: 2015-03-10
LEU, SHYUE TER
Executed: 2015-03-10
YEW, MING-CHIH
Executed: 2015-03-10
YEH, SHU-SHEN
Executed: 2015-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Three Dimensional Integrated Circuit (3DIC) Having a Thermally Enhanced Heat Spreader Embedded in a Substrate