Patent Assignment
Reel/Frame 035262/0256
Assignment of Assignor's Interest
Recorded: 2015-03-26
Pages: 8
Assignors
KANG, PIL-KYU
Executed: 2015-03-24
PARK, BYUNG LYUL
Executed: 2015-03-24
KIM, TAEYEONG
Executed: 2015-03-24
PARK, YEUN-SANG
Executed: 2015-03-24
LEE, DOSUN
Executed: 2015-03-24
LEE, HO-JIN
Executed: 2015-03-24
CHUN, JINHO
Executed: 2015-03-24
CHOI, JU-IL
Executed: 2015-03-24
HONG, YI KOAN
Executed: 2015-03-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having Hybrid Stacking Structures and Methods of Fabricating the Same