Patent Assignment
Reel/Frame 035264/0139
Assignment of Assignor's Interest
Recorded: 2015-03-26
Pages: 4
Assignors
CHEN, YAN-HENG
Executed: 2015-02-21
LIN, CHUN-TANG
Executed: 2015-02-21
CHI, CHIEH-YUAN
Executed: 2015-02-21
CHAN, MU-HSUAN
Executed: 2015-02-21
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Conductive via Structure and Fabrication Method Thereof