Patent Assignment
Reel/Frame 035276/0155
Assignment of Assignor's Interest
Recorded: 2015-03-27
Pages: 4
Assignee
TAIYO INK MFG. CO., LTD.
900, OAZA HIRASAWA, RANZAN-MACHI, HIKI-GUN, SAITAMA, 355-0215, JAPAN
Covered Property
(1)
Curable Resin Composition, Composition for Forming Solder Resist, Dry Film and Printed Wiring Board, and Laminate and Process for Preparing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.