Patent Assignment
Reel/Frame 035276/0618
Assignment of Assignor's Interest
Recorded: 2015-03-27
Pages: 4
Assignors
IWATA, YOSHITAKA
Executed: 2015-01-14
MORI, SHOGO
Executed: 2015-01-14
KAMIYAMA, DAIZO
Executed: 2015-01-15
TSUBOKAWA, KENJI
Executed: 2015-01-27
SOGA, SHINICHI
Executed: 2015-01-30
TANIMOTO, HIDEO
Executed: 2015-02-09
Assignees
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
2-1, TOYODA-CHO, KARIYA-SHI, AICHI-KEN, JAPAN
KYOCERA CORPORATION
6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SHI, KYOTO, 612-8450, JAPAN
Covered Property
(1)
Heat Dissipation Device and Semiconductor Device