Patent Assignment
Reel/Frame 035280/0757
Assignment of Assignor's Interest
Recorded: 2015-03-28
Pages: 6
Assignors
CHI, HEEJO
Executed: 2015-03-10
FOH, BARTHOLOMEW LIAO CHUNG
Executed: 2015-03-16
ALVAREZ, SHEILA MARIE L.
Executed: 2015-03-16
CAMACHO, ZIGMUND RAMIREZ
Executed: 2015-03-16
CUONG, DAO NGUYEN PHU
Executed: 2015-03-09
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Insulated Trace and Method of Manufacture Thereof
Patent:
9,406,642 →
Application:
14/642,130 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.