Patent Assignment
Reel/Frame 035284/0877
Assignment of Assignor's Interest
Recorded: 2015-03-30
Pages: 2
Assignors
HANG, YU-CHIH
Executed: 2013-03-13
HU, YEN-CHANG
Executed: 2013-03-13
HSIAO, CHING-WEN
Executed: 2013-03-13
CHEN, CHEN-SHIEN
Executed: 2013-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Warpage Reduction and Adhesion Improvement of Semiconductor Die Package