IP Library Assignment 035286/0866
Patent Assignment
Reel/Frame 035286/0866

Assignment of Assignor's Interest

Recorded: 2015-03-30 Pages: 6
Assignors
YAMANAKA, YOSHIE
Executed: 2015-01-28
TACHIBANA, KEN
Executed: 2015-01-28
YOSHIKAWA, SHUNSAKU
Executed: 2015-01-28
NOMURA, HIKARU
Executed: 2015-01-28
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property (1)
Lead-Free Solder Ball
Patent: 9,780,055 →
Application: 14/409,412 →
Publication: US 2015/0221606