Patent Assignment
Reel/Frame 035334/0103
Assignment of Assignor's Interest
Recorded: 2015-03-27
Pages: 3
Assignor
XIAO, DEYUAN
Executed: 2015-03-26
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Interconnect Structures and Fabrication Method Thereof