Patent Assignment
Reel/Frame 035353/0135
Assignment of Assignor's Interest
Recorded: 2015-03-25
Pages: 10
Assignors
YU, SHAO-CHI
Executed: 2015-03-10
HUNG, CHIA-MING
Executed: 2015-03-10
HUANG, HSIN-TING
Executed: 2015-03-10
CHEN, HSIANG-FU
Executed: 2015-03-10
CHANG, ALLEN TIMOTHY
Executed: 2015-03-10
TAI, WEN-CHUAN
Executed: 2015-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structure and Method to Mitigate Soldering Offset for Wafer-Level Chip Scale Package (Wlcsp) Applications