Patent Assignment
Reel/Frame 035357/0750
Assignment of Assignor's Interest
Recorded: 2015-04-08
Pages: 4
Assignors
LEE, DAESUNG
Executed: 2015-02-23
HAN, INGYU
Executed: 2015-02-23
PARK, CHULHYUN
Executed: 2015-02-23
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same