IP Library › Assignment 035385/0766
Patent Assignment
Reel/Frame 035385/0766

Assignment of Assignor's Interest

Recorded: 2015-04-10 Pages: 3
Assignors
CUI, LIN
Executed: 2015-04-08
PARK, JASON DAEJIN
Executed: 2015-04-08
Assignee
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY, FREMONT, CALIFORNIA, 94538
Covered Property (1)
Eliminating First Wafer Metal Contamination Effect in High Density Plasma Chemical Vapor Deposition Systems
Application: 14/683,022 →
Publication: US 2016/0300713