Patent Assignment
Reel/Frame 035398/0107
Assignment of Assignor's Interest
Recorded: 2015-04-13
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2015-03-27
CHEN, MING-FA
Executed: 2015-03-27
TSAI, WEN-CHING
Executed: 2015-03-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3D Stacked-Chip Package