Patent Assignment
Reel/Frame 035398/0273
Assignment of Assignor's Interest
Recorded: 2015-04-13
Pages: 6
Assignors
SECKER, DAVID
Executed: 2012-10-31
YANG, LING
Executed: 2012-11-01
TRAN, CHANH
Executed: 2012-10-31
JI, YING
Executed: 2012-10-31
Assignee
RAMBUS INC.
1050 ENTERPRISE WAY, SUITE 700, SUNNYVALE, CALIFORNIA, 94089
Covered Properties
(2)
Distributed on-Chip Decoupling Apparatus and Method Using Package Interconnect
Distributed on-Chip Decoupling Apparatus and Method Using Package Interconnect