Patent Assignment
Reel/Frame 035402/0883
Assignment of Assignor's Interest
Recorded: 2015-04-14
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2015-04-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices