Patent Assignment
Reel/Frame 035408/0289
Assignment of Assignor's Interest
Recorded: 2015-04-14
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structures for Wafer Level Package and Methods of Forming Same