Patent Assignment
Reel/Frame 035425/0877
Assignment of Assignor's Interest
Recorded: 2015-04-16
Pages: 6
Assignors
GAMBINO, JEFFREY P.
Executed: 2012-12-31
LEIDY, ROBERT K.
Executed: 2013-01-02
RASSEL, RICHARD J.
Executed: 2012-12-31
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Thick Bond Pad for Chip with Cavity Package
Application:
14/688,215 →
Publication:
US 2015/0221698
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →