Patent Assignment
Reel/Frame 035427/0569
Assignment of Assignor's Interest
Recorded: 2015-04-16
Pages: 2
Assignors
CHEN, HSIEN-WEI
Executed: 2015-04-08
HSIEH, CHENG-HSIEN
Executed: 2015-04-08
HSU, LI-HAN
Executed: 2015-04-08
CHIH, LAI WEI
Executed: 2015-04-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structures and Method of Forming the Same