Patent Assignment
Reel/Frame 035447/0822
Assignment of Assignor's Interest
Recorded: 2015-04-16
Pages: 3
Assignors
OH, SANG CHUL
Executed: 2015-04-13
PARK, HAE CHAN
Executed: 2015-04-13
LEE, SE HO
Executed: 2015-04-13
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Integrated Circuit Device Having Encapsulation Film and Method of Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.