Patent Assignment
Reel/Frame 035464/0571
Assignment of Assignor's Interest
Recorded: 2015-04-22
Pages: 6
Assignors
KIM, KYUNG-EUN
Executed: 2015-03-10
KIM, DAE-IK
Executed: 2015-03-09
CHO, YOUNG-SEUNG
Executed: 2015-03-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Positioned Landing Pads and Semiconductor Devices Including the Same