IP Library › Assignment 035470/0774
Patent Assignment
Reel/Frame 035470/0774

Assignment of Assignor's Interest

Recorded: 2015-04-22 Pages: 3
Assignors
LEE, CHANG BO
Executed: 2015-04-22
RYU, CHANG SUP
Executed: 2015-04-22
PARK, HYO BIN
Executed: 2015-04-22
CHOI, CHEOL HO
Executed: 2015-04-22
Assignee
SAMSUNG ELECI'RO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property (1)
Method for Forming Solder Resist and Substrate for Package
Patent: 9,040,838 →
Application: 14/011,159 →
Publication: US 2014/0054073
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Previously Recorded on Reel 035470 Frame 0774. Assignor(S) Hereby Confirms the Samsung Electro-Mechanics Co., Ltd.. Apr 27, 2015
From: LEE, CHANG BO; RYU, CHANG SUP; PARK, HYO BIN; CHOI, CHEOL HO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 035508/0148 →