Patent Assignment
Reel/Frame 035503/0653
Assignment of Assignor's Interest
Recorded: 2015-04-27
Pages: 4
Assignors
HOU, HAO-CHENG
Executed: 2015-04-10
LIU, MING-CHE
Executed: 2015-04-10
CHUANG, CHUN-CHIH
Executed: 2015-04-08
CHENG, JUNG WEI
Executed: 2015-04-08
WANG, TSUNG-DING
Executed: 2015-04-16
LIN, HUNG-JEN
Executed: 2015-04-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structures and Methods of Forming the Same