IP Library › Assignment 035512/0407
Patent Assignment
Reel/Frame 035512/0407

Assignment of Assignor's Interest

Recorded: 2015-04-28 Pages: 4
Assignors
CHENG, CHENG-WEI
Executed: 2015-04-23
SADANA, DEVENDRA K.
Executed: 2015-04-24
SHIU, KUEN-TING
Executed: 2015-04-23
SUN, YANNING
Executed: 2015-04-23
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Preparation of Low Defect Density of Iii-V on Si for Device Fabrication
Patent: 9,508,550 →
Application: 14/697,953 →
Publication: US 2016/0322222
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052620/0961 →