IP Library Assignment 035526/0572
Patent Assignment
Reel/Frame 035526/0572

Assignment of Assignor's Interest

Recorded: 2015-04-29 Pages: 11
Assignors
TATENO, HIDETO
Executed: 2015-01-21
WADA, YUICHI
Executed: 2015-01-21
ASHIHARA, HIROSHI
Executed: 2015-01-21
YAMAZAKI, KEISHIN
Executed: 2015-01-21
USHIDA, TAKUROU
Executed: 2015-02-02
NAKAMURA, IWAO
Executed: 2015-02-05
IZUMI, MANABU
Executed: 2015-01-21
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method for Manufacturing Semiconductor Device, and Recording Medium
Patent: 9,816,182 →
Application: 14/608,937 →
Publication: US 2015/0140835
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →