Assignment of Assignor's Interest

Recorded: 2015-04-29 Pages: 3

Assignor

YACHI, MASAMICHI

Executed: 2015-03-27

Assignee

HITACHI KOKUSAI ELECTRIC INC.

14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN

Covered Property (1)

Substrate Processing Apparatus, Method of Processing Substrate, and Method of Manufacturing Semiconductor Device

Patent: 9,548,229 →

Application: 14/431,678 →

Publication: US 2015/0279712

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.