Patent Assignment
Reel/Frame 035533/0842
Assignment of Assignor's Interest
Recorded: 2015-04-30
Pages: 6
Assignors
SEOK, SEUNG-DAE
Executed: 2015-04-17
KIM, SANG-YOON
Executed: 2015-04-17
KIM, HUI-JAE
Executed: 2015-04-17
SHIN, JAE-BONG
Executed: 2015-04-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for Bonding Semiconductor Chips