IP Library › Assignment 035542/0663
Patent Assignment
Reel/Frame 035542/0663

Assignment of Assignor's Interest

Recorded: 2015-05-01 Pages: 4
Assignors
MIYATANI, TATSUYA
Executed: 2015-04-15
MURAKAMI, SEIGO
Executed: 2015-04-15
Assignee
SAKURA FINETEK JAPAN CO., LTD.
1-9 NIHONBASHI-HONCHO, 3-CHOME, CHUO-KU, TOKYO, 103-0023, JAPAN
Covered Property (1)
Thin Section Preparation Device
Patent: 9,983,100 →
Application: 14/439,903 →
Publication: US 2015/0300924