Patent Assignment
Reel/Frame 035549/0964
Assignment of Assignor's Interest
Recorded: 2015-05-01
Pages: 3
Assignee
MARLOW INDUSTRIES, INC.
10451 VISTA PARK ROAD, DALLAS, TEXAS, 75238
Covered Properties
(2)
System for Over-Molded Pcb Sealing Ring for Tec Heat Exchangers
System and Method for Over-Molded Pcb Sealing Ring for Tec Heat Exchangers
Application:
61/940,783 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Notice of Grant of Security Interest in Patents
Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
Assignment of Assignor's Interest
Nov 12, 2019
From: MARLOW INDUSTRIES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 050984/0127 →
Security Interest
Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
Patent Release and Reassignment
Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →