Patent Assignment
Reel/Frame 035551/0326
Assignment of Assignor's Interest
Recorded: 2015-05-01
Pages: 6
Assignors
CHUNG, HYUN-SOO
Executed: 2015-01-15
CHO, TAE-JE
Executed: 2015-01-15
AHN, JUNG-SEOK
Executed: 2015-01-15
LEE, IN-YOUNG
Executed: 2015-01-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Package