Patent Assignment
Reel/Frame 035558/0569
Assignment of Assignor's Interest
Recorded: 2015-05-04
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2015-04-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structure for Die Probing