Patent Assignment
Reel/Frame 035560/0652
Assignment of Assignor's Interest
Recorded: 2015-05-04
Pages: 6
Assignors
LEE, CHIH-CHENG
Executed: 2015-04-24
SU, YUAN-CHANG
Executed: 2015-04-24
SHIH, YU-LIN
Executed: 2015-04-27
YEN, YOU-LUNG
Executed: 2015-04-24
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Including Dielectric Layers Defining via Holes Extending to Component Pads